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Carrier depletion and grain misorientations on individual grain boundaries of polycrystalline Si thin films

机译:多晶硅薄膜各个晶界上的载流子耗竭和晶粒取向不良

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Structural and microelectrical properties of grain boundaries (GBs) in polycrystalline Si thin films were investigated by electron backscattering diffraction (EBSD) and scanning capacitance microscopy (SCM). The SCM measurements revealed highly nonuniform carrier depletions among the GBs, indicating the variety of electrical properties due to the specific GB structures. The EBSD measurement showed that the films are weakly [001]-oriented with small fractions of grains in the [111] and [110] orientations. Comparison of the SCM and EBSD measurements taken on the same film area led to the following observations: (1) ¿3 GBs do not exhibit carrier depletions and thus do not have charged deep levels; (2) Some ¿9 GBs exhibit carrier depletions and some do not, indicating that the intrinsic ¿9 GBs do not have charged deep levels and the carrier depletions are due to impurity gettering at the GBs; (3) No significant relationship between the carrier depletion behavior and the grain misorientation was found so far on the GBs with random misorientations; (4) The carrier depletion behavior does not depend only on the grain misorientation but also on the facet where the GB is taken.
机译:通过电子背散射衍射(EBSD)和扫描电容显微镜(SCM)研究了多晶硅薄膜中晶界(GBs)的结构和微电性能。 SCM测量显示,GB之间的载流子损耗非常不均匀,这表明由于特定的GB结构而导致的电性能多种多样。 EBSD测量表明,薄膜在[111]和[110]取向上具有弱的[001]取向和小部分晶粒。比较在相同膜面积上进行的SCM和EBSD测量得出以下观察结果:(1)3 GB不显示载流子耗尽,因此没有深电荷; (2)某些9 GB的载流子耗尽,而某些9GB的载流子没有耗尽,这表明固有的9 GB的载流子没有深层电荷,并且载流子的耗尽是由于GB处的杂质吸收引起的; (3)到目前为止,在随机取向错误的GBs上,载流子耗尽行为与晶粒取向错误之间没有显着关系; (4)载流子耗尽行为不仅取决于晶粒取向不良,还取决于获取GB的刻面。

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