Control of ultrasound direction with a miniaturized double-transducer for microwelding applications

摘要

Microelectronic Wire Bonding is an ultrasonic microwelding process enabling the economic production of today's microchips by providing flexibel fine wire bond connections between integrated circuit and circuit board or substrate. To further accelerate and improve the quality of this process, a novel ultrasonic double-transducer system is reported with miniaturized dimensions. Based on a previously published design, finite elemente simulations are used to confirm the feasibility and demonstrate the function of the double-transducer numerically.