Non Linear Regression Analysis of Technological Parameters of the Plasma Desmear Process for Rigid-Flex PCB

摘要

The plasma desmear process is one of the crucial problems in the manufacture of rigid-flex printed circuit boards (PCB). The technological parameters of the plasma desmear process for rigid-flex PCBs were optimized by an orthogonal experiment design (OED). Minitab Statistical Analysis Software was used to obtain a nonlinear regression analysis for the data obtained from the orthogonal experiment. Prediction and control for production had been realized by the regression equation. A four-layer high density interconnect (HDI) rigid-flex PCB was developed successfully and the qualification rate reached 92% under the optimum conditions for the plasma desmear process.