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A decrease in the damage threshold in dielectric materials induced by negatively chirped laser pulses

机译:带负啁啾激光脉冲引起的介电材料损伤阈值的减小

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The threshold fluence for laser induced damage in wide band gap dielectric materials, such as fused silica and MgF_2, is observed to be lower by up to 20% for negatively (down) chirped pulses than for positively (up) chirped, at pulse durations ranging from 60 fs to 1 ps. This behavior of the threshold fluence for damage on the chirp direction was not observed in semiconductors, such as silicon and GaAs. Based on a model describing electron generation in the conduction band and Joule heating, it is suggested that the decrease in the damage threshold for negatively chirped pulse is related to the role of multiphoton ionization in wide gap materials.
机译:激光诱导宽带隙电介质材料的阈值流量,例如熔融二氧化硅和MgF_2,脉冲持续的脉冲持续的脉冲(向下)啁啾脉冲的宽带隙介电材料(例如熔融二氧化硅和MgF_2)的损伤均高达20%。 从60 fs到1 ps。 在半导体中未观察到啁啾方向损坏的阈值流量的这种行为,例如硅和GaAs。 基于描述导电带和焦耳加热中的电子产生的模型,建议对带负啁啾脉冲的损伤阈值的降低与宽间隙材料中的多选电离的作用有关。

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