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Top-gate ZnO-based TFTs by RF Sputtering

机译:射频溅射的顶栅基于ZnO的TFT

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This work emphasizes room temperature deposition and fabrication of top-gated staggered structure ZnO-TFTs and integration of ZnO-TFT based simple logic circuits. We synthesized ZnO thin films by RF sputtering in an Ar/Oxygen ambience with no intentional heating of the substrates. The electrical, optical and structural properties of the ZnO thin films can be well-controlled by altering process parameters such as RF power density and relative Oxygen partial pressure. Typical deposition was carried out at a chamber pressure of 15 mTorr, Ar/Oxygen flow rates of 15 sccm/1 seem and RF power density of 3W/cm~2. The resistivity of the as-deposited films was between 10~4-10~6 Ω-cm with high optical transparency (>80%) in the visible spectrum and minimal surface roughness as detected by high-resolution AFM imaging. Gated van der Pauw and Kelvin-bridge structures were lithographically patterned to asses ZnO channel resistance. In the completed devices, a dual-stack (Ta_2O_5/SiO_2) dielectric layer was effective in suppressing gate-leakage current below 10 pA and enabled depletion-mode ZnO-TFT operation exhibiting hard saturation. A Ti/Au metallization scheme was adopted to provide good ohmic contact to ZnO. TFTs retained well-behaved transfer characteristics down to a channel length of 4 μm with on/off drain current ratio exceeding 10~5, threshold voltage between -15 V to -5 V and inverse sub-threshold slope of around 1.75 V/decade.
机译:这项工作着重于室温沉积和顶部门控交错结构ZnO-TFT的制造以及基于ZnO-TFT的简单逻辑电路的集成。我们在Ar /氧气环境中通过RF溅射合成了ZnO薄膜,而没有故意加热基板。可以通过更改工艺参数(例如RF功率密度和相对氧分压)来很好地控制ZnO薄膜的电,光学和结构特性。典型的沉积是在15 mTorr的腔室压力,15 sccm / 1 sccm的Ar /氧气流速和3W / cm〜2的RF功率密度下进行的。沉积薄膜的电阻率在10〜4-10〜6Ω-cm之间,通过高分辨率AFM成像检测,可见光谱中的光学透明度高(> 80%),表面粗糙度最小。通过光刻对门控的范德堡和开尔文桥结构进行构图,以评估ZnO沟道电阻。在完成的器件中,双堆叠(Ta_2O_5 / SiO_2)介电层可有效抑制10 pA以下的栅极漏电流,并使耗尽型ZnO-TFT操作呈现出饱和状态。采用Ti / Au金属化方案可为ZnO提供良好的欧姆接触。 TFT保留了良好的传输特性,其沟道长度低至4μm,开/关漏极电流比超过10〜5,阈值电压在-15 V至-5 V之间,并且亚阈值反斜率约为1.75 V /十倍。

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