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Thermal analysis of 8-T SRAM for nano-scaled technologies

机译:用于纳米技术的8-T SRAM的热分析

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Different sections of a cache memory may experience different temperature profiles depending on their proximity to other active logic units such as the execution unit. In this paper, we perform thermal analysis of cache memories under the influence of hot-spots. In particular, 8-T SRAM bitcell is chosen because of its robust functionality at nano-scaled technologies. Thermal map of entire 8-T SRAM cache is generated using hierarchical compact thermal models while solving the leakage and temperature self consistently. The impact of spatial temperature variations on 8T-SRAM parameters such as local bitline (LBL) sensing delay, noise robustness and bitcell stability are evaluated for 45nm/32nm/22nm bulk CMOS technology nodes. The effectiveness of variable keeper sizing on LBL sensing delay is analyzed. It is predicted that at 22nm node, the leakage induced temperature rise has severe effects on the 8-T SRAM characteristics.
机译:高速缓冲存储器的不同部分可能会经历不同的温度曲线,这取决于它们与其他活动逻辑单元(例如执行单元)的接近程度。在本文中,我们在热点的影响下对缓存进行热分析。特别是,选择8-T SRAM位单元是因为它在纳米级技术上具有强大的功能。整个8-T SRAM高速缓存的热图是使用分层紧凑的热模型生成的,同时可以自洽解决泄漏和温度问题。针对45nm / 32nm / 22nm块状CMOS技术节点,评估了空间温度变化对8T-SRAM参数(如本地位线(LBL)感测延迟,噪声鲁棒性和位单元稳定性)的影响。分析了LBL感应延迟的变量保持器大小的有效性。可以预测,在22nm节点处,泄漏引起的温度升高会对8-T SRAM特性产生严重影响。

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