NanoBond~R offers an improved method for bonding sputtering targets to backing plates. It utilizes a metallic foil, NanoFoil~R, to generate localized heating during bonding. The heat is so precisely controlled that, while it is sufficient to reflow solder layers, it does not heat up the target or backing plate. Stress-free bonding of any combination of materials using high melting temperature solder is therefore possible. NanoBond thus offers many advantages compared to conventional bonding processes.
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