Wafer Defects Detecting and Classifying System Based on Machine Vision

摘要

The wafer defects detecting and classifying system based on machine vision aims at inspecting macro wafer defects. After acquiring disk images using CCD, through digital images process we realized defects inspection and defects segmentation. Finally defects classification was achieved by neural networks. The experiment results prove that the proposed system features a strong background of specialty and can be applied into practice.