A new SOI Single Chip Inverter IC implemented into a newly designed SMD package

摘要

Transfer mold technology was introduced about 10 years ago to manufacture small Intelligent Power Modules (IPMs) of I_c ＜ 25A utilizing dedicated HVICs, IGBTs and FwDi. The current range of the IPMs has been extended from 3A to 50A and the packaging technology has been improved with respect to package weight and thermal resistance successively. At the lower end of the drive power, e.g. drives having a typical power rating of 100W or less, there was no IPM solution available and those drives were built up utilizing discrete IGBT & FwDi / MOSFET and High Voltage Integrated Circuits (HVIC). The new highly integrated surface mountable IPM allows a significant space reduction and the employment of extended protection functions like short circuit (SC) and over temperature (OT) protection with a space requirement on a printed circuit board (PCB) of less than the equivalent of the 6 before mentioned IGBTs only.