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UNDERFILL FLOW PERFORMANCE ASSESSMENT

机译:溢流性能评估

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摘要

It is a common practice in the industry to use a single flip chip configuration to compare the flow performance for different underfill. However it has been a mystery whether bump configuration will affect the flow performance consistently over different types of underfill. In this paper the flow performance of 3 underfills are studied over 6 bump configurations. The result has validated the claim that a single bump configuration is sufficient in comparing the flow performance of underfills.
机译:在行业中,通常使用单个倒装芯片配置来比较不同底部填充的流性能。然而,凹凸结构是否会持续影响不同类型的底部填充材料的流动性能一直是个谜。在本文中,研究了3种底部填充材料在6种凸点结构上的流动性能。结果证实了单个凸块配置足以比较底部填充胶的流动性能的说法。

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