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Study of Thick Tungsten Coatings Deposited on the Different Substrates

机译:不同基材上沉积的厚钨涂层的研究

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Thick pure tungsten coatings were deposited on molybdenumand copper substrate by vacuum plasma spray for differentpurpose. The microstructures of tungsten coatings wereinvestigated by X-ray diffraction (XRD) and scanning electronmicroscopy (SEM). The effect of preheating temperature ofthe substrate and introduction of gradient bond layer on theadhesive strength of the coating was investigated. High heatload was tested by high power electron beam bombardmentonly for tungsten coating on copper. All the results show thatthe properties of tungsten coating were strongly influenced bydifferent processes, and the density of the coatings is close to95% of theory density.
机译:厚的纯钨涂层沉积在钼上 和铜基板通过真空等离子喷涂的不同 目的。钨涂层的显微组织为 通过X射线衍射(XRD)和扫描电子进行研究 显微镜(SEM)。预热温度的影响 基板和在基板上引入梯度键合层 研究了涂层的粘合强度。高温 通过大功率电子束轰击测试了负载 仅用于铜上的钨涂层。所有结果表明 钨涂层的性能受到以下因素的强烈影响 不同的过程,并且涂层的密度接近 理论密度的95%。

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