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Processing and Performance of Broadband Integrated Resistor Structures on non-Planar Topologies in Hermetic Silicon Enclosure with Vertical Micro Vias

机译：带有垂直微孔的密封硅外壳中非平面拓扑上宽带集成电阻器结构的处理和性能

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1539-1543|共5页
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Greisen C.G.; Hauffe R.; Shiv L.; Weichel S.; Korth H.; Kilian A.; Heschel M.; Kuhmann J.;
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4. Processing and Performance of Broadband Integrated Resistor Structures on non-Planar Topologies in Hermetic Silicon Enclosure with Vertical Micro Vias [C] . Christoffer Graae Greisen, Ralf Hauffe, Lior Shiv, Electronic Components and Technology Conference . 2006

机译：具有垂直微通孔的密封硅外壳中非平面拓扑结构的宽带集成电阻结构的加工和性能
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