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Electrical design optimization and characterization in Cell Broadband Engine package

机译:单元宽带引擎封装中的电气设计优化和特性

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Cell Broadband Engine is a microprocessor that has very high processing performance and very high speed I/O to communicate with other devices such as system LSI and memory chips. Design optimization with statistical analysis was carried out. DOE matrix was made with dimension of signal traces and dielectric constant of the insulator in the package substrate. After major factors were detected, random sampling was done to make sure that the distribution of characteristic impedance of signal traces is within the specification. Passive characterization was carried out with test vehicle. Insertion loss and characteristic impedance is dependent on both temperature and water absorption. These environmental factors need to be taken into account when the design rule is determined. After design rule is fixed, circuit simulation for whole signal channel was carried out with considering impedance tolerance in both the package and the printed circuit board. DOE matrix was made and analyzed to determine the major factors on mid-frequency and low-frequency noise in power distribution. Inductance of package substrate and decoupling capacitor are the major effect on the mid-frequency noise, and capacitance of on-module and on-PCB affect low frequency noise. The effect of on-chip parameters was also evaluated. Several types of capacitors were characterized to measure their parasitic parameters
机译:Cell Broadband Engine是一种微处理器,具有非常高的处理性能和非常快的I / O,可以与其他设备(例如系统LSI和存储芯片)进行通信。进行了具有统计分析的设计优化。用信号轨迹的尺寸和封装基板中绝缘子的介电常数制成DOE矩阵。在检测到主要因素之后,进行随机采样以确保信号迹线的特征阻抗分布在规格范围内。用测试载体进行被动表征。插入损耗和特性阻抗取决于温度和吸水率。确定设计规则时,必须考虑这些环境因素。在确定了设计规则后,考虑了封装和印刷电路板的阻抗容差,对整个信号通道进行了电路仿真。制作并分析DOE矩阵,以确定影响配电中中频和低频噪声的主要因素。封装基板和去耦电容器的电感是影响中频噪声的主要因素,而模块上和PCB上的电容会影响低频噪声。还评估了片上参数的影响。表征了几种类型的电容器以测量其寄生参数

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