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Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs

机译：环境对PEM中模塑料和焊线降解的影响

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1415-1424|共10页
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Teverovsky A.;
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4. Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs [C] . Teverovsky A. Electronic Components and Technology Conference . 2006

机译：环境对PEMS中模塑化合物和钢丝键劣化的影响
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