Smaller, thinner power delivery and higher power consumption circuits require smaller devicesbut higher capacitance for output filtering and input or battery decoupling. Moving thehigh capacitance electrolytic capacitors from the larger case offerings to the smaller case sizeshas resulted in a reduced capacitance per unit volume as the internal connection methods to theleadframe takes up a larger percentage of the total volume. Eliminating some of these internalconnections and reducing the leadframe to the solder attachment points at the bottom face of thechip capacitors allows some smaller case's efficiencies to increase by over 100%.The elimination of extraneous leadframe also creates a smaller current loop that reduces theESL (effective series inductance) of the component by close to 50%. Sub nanoHenries inductanceis now achievable in surface-mount, solid-state, electrolytic capacitors.
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