首页> 外文会议>International Symposium on CIGRE/IEEE PES, 2005 >Studies of inductively coupled plasma source antenna symmetry andcharacterisation of an SiO2 sputtering plasma
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Studies of inductively coupled plasma source antenna symmetry andcharacterisation of an SiO2 sputtering plasma

机译:电感耦合等离子体源天线对称性的研究SiO 2 溅射等离子体的表征

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Summary form only given. Simulations of inductively coupledplasmas (ICPs) typically simplify the driving antenna by analyzing it ascomposed of symmetric rings. To investigate the effects of thisapproximation and to explore the performance of an ICP source withimproved symmetry, an axisymmetric antenna design has been established.These antennae can be easily constructed with varied geometries and RFpower intensity patterns. The characteristics of an ICP source driven bya standard “stove element” antenna are compared with thoseof an ICP source driven by the symmetric antenna configuration. Sourceoptimization is then studied by using varying geometries of thesymmetric antenna configuration. Initial results and comparisons withpublished simulations are presented. We also report initial results of astudy of plasma damage mechanisms in the formation of sputtered MOScapacitors. MOS capacitors can be produced by depositing SiO2onto an Si substrate using a source such as a Kurt Lesker magnetronsputter source and then evaporating a metal film pattern over the SiO2. The performance of these MOS capacitors depends both onthe quality of the sputter deposition and any plasma inflictedcollateral damage. The MOS capacitor performance can be analyzed using agraphical technique that identifies and classifies surface defect levelsfrom the capacitor's C-V characteristics
机译:仅提供摘要表格。电感耦合的仿真 等离子体(ICP)通常通过将驱动天线分析为 由对称环组成。调查这种效果 近似并探索ICP源的性能 为了改善对称性,已经建立了轴对称天线设计。 这些天线可以很容易地构造成具有各种几何形状和射频 功率强度模式。由ICP驱动的ICP源的特性 将标准的“炉形”天线与那些 由对称天线配置驱动的ICP源的示意图。来源 然后,通过使用不同的几何形状来研究优化 对称天线配置。初步结果和与 介绍了已发布的模拟。我们还报告了 MOS形成过程中等离子体损伤机理的研究 电容器。可以通过沉积SiO 2 来生产MOS电容器 使用诸如Kurt Lesker磁控管之类的源将其沉积到Si衬底上 溅射源,然后在SiO上蒸发金属膜图案 2 。这些MOS电容器的性能取决于 溅射沉积的质量以及所施加的任何等离子体 附带损害。 MOS电容器的性能可以使用 识别和分类表面缺陷级别的图形技术 从电容器的C-V特性

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