DETECTING DEFECTS AND THE ONSET OF FAILURE OF ADHESIVE BONDS USING ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY

摘要

Tape sensors were mounted on the adherends and the health of the adhesive bonds was studied by electrochemical impedance spectroscopy. Results show that EIS measurements can discriminate bonded and unbonded areas in CFRP-Alsystems. The EIS measurements are also sensitive to the weakening of adhesive bonds caused by exposure to humidity at high temperatures.