nickel; copper; electrical contacts; micromechanical devices; contact resistance; electroplating; plastic deformation; electric contact properties; Ni microsprings; MEMS probe card; pitch array; three dimensional spring structures; circuit board; multilayer electroplating process; electroplated layers; mechanical properties; Cu electrodes; contact resistance; folded lever springs; 1 micron; 250 micron; Ni; Cu;
机译:细间距MEMS探针卡的沟槽型悬臂探针的双步DRIE和Ni-Co电镀工艺效果
机译:MEMS探针卡低力接触过程的特性
机译:采用MEMS技术的低接触电阻探针卡
机译:MEMS探针卡NI微弹簧的接触性能
机译:电气传输性能的非接触式光学探针:光伏的应用
机译:用密度泛函理论研究谷胱甘肽与过渡金属离子(Cr2 +Mn2 +Fe2 +Co2 +Ni2 +Cu2 +Zn2 +Cd2 +Hg2 +)的配位性能
机译:基于MEMS的Ni–B探针,具有增强的机械性能,可用于细间距测试