Modeling interconnect behavior with a calibrated FEM model

摘要

As dimensions continue to shrink and device densities increase, power and heat dissipation become an ever-increasing challenge. In this work, we investigate heat flow ramifications for a variety of very simple patterns. We start by describing the use of a finite element method (FEM) tool. This includes a brief description of the modeling procedure. The model results, for a given set of boundary conditions, are then compared to the physical measurements for that structure. Excellent agreement is demonstrated, thus calibrating the model. We then extend this model to structures for which we have no physical measurements. As importantly, we extend this model to structures and patterns that may be desirable for the next generation.