integrated circuit modelling; thermal resistance; integrated circuit interconnections; integrated circuit reliability; thermal conductivity; dielectric thin films; thermal management (packaging); glass; copper; electromigration; thermal resistance measurement; Joule heating measurements; interconnect Joule heating limitation; BEOL reliability; thermal conductivity analytical extraction; low k dielectrics; thermal management; fluorinated silicate glass; phosphorous silicate glass; FSG; PSG; embedded copper lines; dielectric stack configurations; thermal model; root mean square currents; dissipated power; IMD; electromigration; 25 degC; SiOCH; Cu;
机译:先进互连结构的复合低k电介质导热系数的确定
机译:具有高导热率和低损耗因子的环氧纳米复合材料:通过核心壳结构和微纳米技术实现低内容的3D导热网络
机译:高性能六方氮化硼/双马来酰亚胺复合材料,具有高导热率,低热膨胀系数和低介电损耗
机译:高k电介质热传导恒定技术的分析提取
机译:适用于高级热电应用的低导热率材料。
机译:依次采用水热辅助萃取超声和热技术从大型藻类中提取多糖和抗氧化剂
机译:CuO-TiO 2 -nb 2 sub> o 5 -2 2 2 2 2 2 2 2 2 < / sub> O 3 sub>陶瓷,具有卓越的导热率