Technical trends in amorphous silicon based uncooled IR focal plane arrays

摘要

After the development of an amorphous silicon based uncooled microbolometer technology, LETI and ULIS are now working to facilitate the infrared focal plane arrays (IRFPA) integration into equipment in order to address a very large market. Achievement of this goal needs the integration of advanced functions on the focal plane and the decrease of manufacturing cost of IRFPA by decreasing the pixel pitch and simplifying the vacuum package. We present in this paper the new designs for readout circuit and packages which will be used for 320 x 240 and 160 x 120 arrays with a pitch of 35 μm.