. The proliferation of mobile phones throughout the world has fueled the interest and growth in 3-D IC (integrated circuit) packages. For the latest phone models to attract consumers, multiple product features must be packed within a sleek, "cool"-looking handset. Thus, miniaturization--whether by chip integration or "system-on-chip" (SOC), in the package, or with packages--is key to this market. 3-D packages, which are a subset of System-in-Package (SiP) solutions, are able to extract greater overall product performance, by stacking die vertically within a standard package form factor while using standard assembly technologies for high volumes and low cost. The latter is attractive to the handset market, where product life cycles are short and cost-driven. One very popular combination for mobile phones is stacking Flash and SRAM together in a single chip-scale package (CSP) form factor. Adding an ASIC to the stack creates a 3-die stacked CSP. Other device types can be combined within a given package. However, while not unique, the assembly technologies necessary to produce a package that can be manufactured in high volume do sometimes push the upper limits of equipment and process capabilities. As the drive continues to make these packages even more compact, other manufacturing techniques and innovations may be required. This paper will describe 3D IC packages' present status and their future trends.
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