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New Laser Machining Processes for Shape Memory Alloys

机译:形状记忆合金的新激光加工工艺

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Due to special material properties, shape memory alloys (SMA) are finding increasing attention in micro system technology. However, only a few processes are available for the machining of miniaturized SMA-components. In this connection, laser material processing offers completely new possibilities.This paper describes the actual status of two projects that are being carried out to qualify new methods to machine SMA components by means of laser radiation.Within one project, the laser material ablation process of miniaturized SMA-components using ultra-short laser pulses (pulse duration: approx. 200 fs) in comparison to conventional laser material ablation is being investigated. Especially for SMA micro-sensors and actuators, it is important to minimize the heat affected zone (HAZ) to maintain the special mechanical properties. Light-microscopic investigations of the grain texture of SMA devices processed with ultra-short laser pulses show that the HAZ can be neglected.Presently, the main goal of the project is to qualify this new processing technique for the micro-structuring of complex SMA micro devices with high precision.Within a second project, investigations are being carried out to realize the induction of the two-way memory effect (TWME) into SMA components using laser radiation. By precisely heating SMA components with laser radiation, local tensions remain near the component surface. In connection with the shape memory effect, these tensions can be used to make the components execute complicated movements. Compared to conventional training methods to induce the TWME, this procedure is faster and easier. Furthermore, higher numbers of thermal cycling are expected because of the low dislocation density in the main part of the component.
机译:由于特殊的材料特性,形状记忆合金(SMA)在微系统技术中受到越来越多的关注。但是,只有很少的工艺可用于加工小型化的SMA组件。在这方面,激光材料加工提供了全新的可能性。本文介绍了两个项目的实际状态,这些项目正在进行中,旨在通过激光辐射来鉴定加工SMA组件的新方法。与传统的激光材料烧蚀相比,正在研究使用超短激光脉冲(脉冲持续时间:约200 fs)的小型化SMA组件。特别是对于SMA微传感器和执行器,重要的是最小化热影响区(HAZ)以维持特殊的机械性能。对超短激光脉冲加工的SMA器件的晶粒组织进行光学显微镜研究表明,可以忽略热影响区。在第二个项目中,正在进行研究以实现使用激光辐射将双向记忆效应(TWME)感应到SMA组件中。通过用激光辐射精确加热SMA组件,局部张力会保留在组件表面附近。结合形状记忆效果,这些张力可用于使组件执行复杂的运动。与诱导TWME的常规训练方法相比,此过程更快,更容易。此外,由于部件主要部分的位错密度低,因此有望实现更高的热循环次数。

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