An Overview of the Pros and Cons of the Main Advanced Imaging Processes, from the Third-Person Standpoint

摘要

Beyond 75/75-μm L/S, alternative imaging methods are requested for the manufacturing of advanced PCBs. This paper will investigate various advanced imaging processes and build from the 3rd-person stand point an objective comparison chart (pros and cons) depending on applications. In particular, the main imaging methods (conventional imaging, UV-direct imaging, thermal direct imaging (TDI), laser structuring, step & repeat, projection lithography, etc.) will be described, and their pros and cons reviewed, from the 3rd person stand point. Total cost of ownership issues will also be discussed.