2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167)

摘要

The following topics were covered: product reliability; process and reliability interactions; MEMS reliability characterisation; packaging and assembly; oxide; wafer level reliability for interconnects; optoelectronics and compound semiconductors; ESD/latchup; failure analysis; process induced damage; interconnect reliability; hot carriers.