首页> 外文会议>Electron Devices Meeting, 2001. IEDM Technical Digest. International >Evaluation of material property requirements and performance of ultra-low dielectric constant insulators for inlaid copper metallization
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Evaluation of material property requirements and performance of ultra-low dielectric constant insulators for inlaid copper metallization

机译:镶嵌铜金属化用超低介电常数绝缘子的材料性能要求和性能评估

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摘要

Technological challenges for selection and integration of ultra-low dielectric constant insulators are discussed. Correlations of material properties with their performance in 1 level-metal inlaid copper integration are established. Dielectric constants of candidate materials are estimated from line-to-line capacitance measurements and FEM. Implications regarding the changes in dielectric constant are discussed.
机译:讨论了用于选择和集成超低介电常数绝缘体的技术挑战。建立了物质性能与其性能的相关性,建立了1级金属镶嵌铜集成。候选材料的介电常数从线到线电容测量和FEM估计。讨论了关于介电常数变化的影响。

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