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Patterning of Diamond Films by RIE and its MEMS Applications

机译:RIE在金刚石膜上的图案化及其MEMS应用

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CVD diamond film is an attractive potential material for microelectronics and MEMS applications, but patterning of diamond is one of the main difficulties hindering diamond electronics. In this paper, we studied the RIE process for precise patterning of diamond films. Ni/Cr, Cu/Cr or NiTi filsm were used as maskants, oxygen as reactive gas. The etching results showed that the NiTi filmm has high etching selectivity when used as mask for diamond etching and it is very convenient to be patterned by the special developed chemical etchant. Using O_2 as main etching gas, the RIE can etch the diamond film effectively. The process parameters such as RF power, vacuum pressure have marked influence on the etching rate and the etched surface. Consider the etching rate and the smoothness of the etched surface, the optimized process parameters for patterning of diamond films has been defined. Combined with sacrifice layer process and electroplating through mask technique diamond micro hinge has been fabricated on silicon wafer.
机译:CVD金刚石膜对于微电子学和MEMS应用是有吸引力的潜在材料,但是金刚石的图案化是阻碍金刚石电子学的主要困难之一。在本文中,我们研究了用于钻石膜精确图案化的RIE工艺。使用Ni / Cr,Cu / Cr或NiTi膜作为掩蔽剂,使用氧气作为反应气体。刻蚀结果表明,NiTi膜用作金刚石刻蚀的掩模时,具有很高的刻蚀选择性,通过特殊研制的化学刻蚀剂可以很方便地进行构图。使用O_2作为主要蚀刻气体,RIE可以有效地蚀刻金刚石膜。诸如RF功率,真空压力的工艺参数对蚀刻速率和蚀刻表面具有显着影响。考虑到蚀刻速率和被蚀刻表面的光滑度,已定义了用于金刚石膜构图的最佳工艺参数。结合牺牲层工艺和掩模技术进行电镀,在硅片上制作了金刚石微铰链。

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