Development of environmental friendly (green), thermally enhanced mold compound (TEMC) for advanced packages

摘要

This paper outlines the development and performance of a new series of mold compounds with thermal conductivity (/spl lambda/) up to 100/spl times/10/sup -4/ cal/cm/spl middot/s/spl middot/C (4.2 W/m/spl middot/K). The alumina and mixture of aluminum nitride and alumina filled mold compound feature a coefficient of thermal expansion of /spl sim/10 ppm/K, low warpage with one-side molded BGAs and good anti-solder cracking performance. Being "green", these halogen and antimony free encapsulants are able to pass high temperature storage life (HTSL) tests at 175/spl deg/C for more than 1000 hrs. These features are made possible with use of optimum combinations of a carefully selected filler system (up to /spl sim/80vol%), epoxy resin system, latent catalyst and new "green" compound technology. Thermal performance indices such as /spl theta//sub ja/ values at board level are currently being measured.