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Study of the leakage drain current components in accumulation-mode soi pMOSFETs at high-temperatures

机译:高温下累积模式soi pMOSFET中漏漏电流分量的研究

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In this work the study of the leadage drain current components in Accumulation-Mode SOI pMOSFETs operating at high-temperatures is presented. The proposed analyses is based on experimental leakage drain current measurements for the device operating from room up to 300 deg C as a function of the back gate bias. It is observed that in SOI pMOSFET the leakage drain current that flows through the silicon film is composed not only by holes but also by electrons when the device is operating at hightemperatures. The results are observed experimentally and supported by MEDICI numerical bidimensional simulations.
机译:在这项工作中,研究了在高温下工作的累积模式SOI pMOSFET中的引线漏极电流分量。所提出的分析是基于实验性泄漏漏电流测量得出的,该器件是背栅偏置的函数,其工作温度范围是从室温到300℃。可以看出,在SOI pMOSFET中,当器件在高温下工作时,流经硅膜的漏漏电流不仅由空穴构成,而且还由电子构成。实验观察结果,并得到MEDICI数值二维模拟的支持。

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