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APPLICATION OF COPPER VAPOR LASER FOR PROCESSING OF MICROELECTRONICS ARTICLES

机译:铜蒸气激光在微电子制品加工中的应用

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Parameters of lasers used in processing various materials are presented. Particulars are defined in processing aluminum, gold and copper with copper vapor laser beam. The objective of the present work is the analysis of energy balance of a single pulse of CVL radiation making an impact on a metal target. We show that: 1. Absorption and scattering of CVL radiation pulse energy by decomposition products of copper target under the influence of this radiation are insignificant. 2.Energy, that is captured by decomposition products of copper target under the influence of narrow-focused copper vapour laser radiation with power density 10~9 W/sm~2 can drastically exceed the energy of material evapouration and consititute a larger part of radiation pulse energy. The limiting capabilities of such processes are demonstrated.
机译:介绍了用于加工各种材料的激光器的参数。在用铜蒸气激光束加工铝,金和铜时定义了细节。本工作的目的是分析对金属靶产生影响的单脉冲CVL辐射的能量平衡。我们表明:1.在这种辐射的影响下,铜靶的分解产物对CVL辐射脉冲能量的吸收和散射是微不足道的。 2,在能量密度为10〜9 W / sm〜2的窄聚焦铜蒸气激光辐射的影响下,铜靶的分解产物所捕获的能量可以大大超过材料蒸发的能量,并辐射出更大的一部分辐射脉冲能量。演示了此类过程的限制功能。

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