首页> 外文会议>Electron Devices Meeting, 1999. IEDM Technical Digest. International >Development of Ru/Ta/sub 2/O/sub 5//Ru capacitor technology for giga-scale DRAMs
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Development of Ru/Ta/sub 2/O/sub 5//Ru capacitor technology for giga-scale DRAMs

机译:开发用于千兆级DRAM的Ru / Ta / sub 2 / O / sub 5 // Ru电容器技术

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In this paper, the Ru/crystalline-Ta/sub 2/O/sub 5//Ru capacitor was investigated. We studied the electrical properties and introduced an Al/sub 2/O/sub 3/ capping layer to prohibit the degradation of the leakage current resulted from H/sub 2/ annealing. Also, the Ru cylinder-type structure was suggested as a 3-dimensional storage node shape and was confirmed in its extendibility to 0.1 /spl mu/m-scaled design rule.
机译:在本文中,研究了RU /晶体-TA /亚/ o / o / sub 5 // ru电容器。我们研究了电气性质并引入了Al / Sub 2 / O / Sub 3 /覆盖层,以禁止从H / SUB 2 /退火产生的漏电流的劣化。此外,Ru缸型结构被建议为三维存储节点形状,并在其与0.1 / SPL MU / M级设计规则的可扩展性中确认。

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