S-TBGA: A Cost Effective Alterniative to Enhanced PBGAs

摘要

Enhanced PBGAsusing multilayer PCB substrates are preferred fr aplicatons that require thermal nad electrical eprformance that is higher ocmpared to the standard two-layer PBGAs. The additional power and grund planes in the substrate provide for shorter routes with low electrical parasitics nad lwo noise. A four layer substrate increases thermal ocnductivity and power dissipatin by about 30