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Development of heat dissipation structure for face-down bonded devices

机译:面向下的键合器件的散热结构的开发

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We developed a heat dissipation structure for face-down bonded surface acoustic wave (SAW) filter packages. This structure enables compact packages at low cost. Heat dissipation from the transmission (Tx) SAW filter and filter sealing are important factors in enhancing package reliability. Tx and reception (Rx) SAW filters were bonded on a printed wiring board (PWB) with a branching circuit, and the filters were sealed with a metallic lid using conductive adhesive. High thermal conductivity adhesive was used to fill between the Tx SAW filter and the metallic lid, enabling the heat of the Tx SAW filter to be dissipated. The filter properties of the package using this high thermal conductivity adhesive were not changed after 500 hour operation with 5 W input RF signals. Results following the performance of thermal shock tests also confirmed characteristics indicating an extremely tight seal, with a rate of helium leakage of only 10/sup -8/ atm/spl middot/cc/s. Thus, as indicated in detail by these results, we concluded that the structure which we developed has been proven to be suitable for application to SAW filter packages.
机译:我们为面朝下的键合声表面波(SAW)滤波器封装开发了一种散热结构。这种结构能够以低成本实现紧凑的包装。变速箱(Tx)SAW过滤器的散热和过滤器密封是提高封装可靠性的重要因素。 Tx和接收(Rx)SAW滤波器通过分支电路粘合在印刷线路板(PWB)上,并使用金属粘合剂用导电粘合剂密封滤波器。高导热胶被用于填充Tx SAW过滤器和金属盖之间,从而使Tx SAW过滤器的热量得以消散。使用5 W输入RF信号运行500小时后,使用这种高导热胶粘剂的包装的过滤性能未发生变化。热冲击试验后的结果也证实了特性,表明密封非常紧密,氦气泄漏率仅为10 / sup -8 / atm / spl middot / cc / s。因此,如这些结果所详细说明的,我们得出的结论是,我们开发的结构已被证明适用于SAW滤波器封装。

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