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TRANSPORT CRITICAL CURRENT DENSITY DISTRIBUTIONS IN Ag/Bi-2223 TAPES

机译:Ag / Bi-2223胶带中的运输临界电流密度分布

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IV characteristics have been studied for monocore Ag sheathed Bi-2223 tapes, fabricated from both sol-gel and mechanically-milled precursor powders. Results have been obtained with the c-axis of the sample both parallel and perpendicular to the applied field, together with the force-free orientation. The angular dependence of the critical current has also been measured. The IV characteristics have been analysed in terms of their n-value and second-differential. The spatial dependence of the critical current has been measured using a scanning Hall probe. The results suggest that the transport current follows a percolative path which is limited by current flow in the c-axis direction, and that most of the current flows in a thin layer of highly aligned Bi-2223 grains near to the Ag sheath. The limiting mechanism in the c-axis direction is thought to be weak-link grain boundaries.
机译:已经研究了由溶胶-凝胶和机械研磨的前驱体粉末制成的单芯银包覆的Bi-2223胶带的IV特性。样品的c轴平行于和垂直于所施加的场,以及无力方向,都获得了结果。还已经测量了临界电流的角度依赖性。已根据n值和二次微分对IV特性进行了分析。临界电流的空间依赖性已经使用扫描霍尔探头进行了测量。结果表明,传输电流遵循在c轴方向上受电流限制的渗流路径,并且大多数电流在靠近Ag鞘的薄层高取向Bi-2223晶粒中流动。在c轴方向上的限制机制被认为是弱链接晶界。

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