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High critical current densities in Nb_3Sn films with engineered microstructures - artificial pinning microstructures

机译:具有工程微结构的Nb_3Sn膜中的高临界电流密度-人工钉扎微结构

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Films with layers of Nb, Cu, and Sn have been fabricated to simulate a Nb_3Sn bronze-type process. These Nb_3Sn films have produced critical current densities greater than 1 x 10~6 A/cm~2 at 4.2 K and 7.5 T. Niobium films doped with Y, Sc, Dy, Al_2O_3, and Ti have been deposited with e-beam co-evaporation onto 75 mm diameter Si wafers with a 100 nm SiO_2 buffer layer. The Nb layer was followed by a layer of Cu and a layer of Sn to complete the bronze-type process. The films with the highest J_c had about 8 vol.
机译:已经制作了具有Nb,Cu和Sn层的薄膜来模拟Nb_3Sn青铜型工艺。这些Nb_3Sn薄膜在4.2 K和7.5 T下产生的临界电流密度大于1 x 10〜6 A / cm〜2。掺有Y,Sc,Dy,Al_2O_3和Ti的铌薄膜已通过电子束共沉积形成。蒸发到具有100 nm SiO_2缓冲层的75毫米直径的Si晶片上。在Nb层之后是一层Cu和一层Sn,以完成青铜型工艺。 J_c最高的电影大约有8卷。

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