Polycrystaline silicon films (5 to 30 um m thick) have been deposited on glass substrates at low temperatures (400-550 deg C) with a rate of 15 A/s by hot-wire chemical vapour deposition (HWCVD).The homogeneity of the deposited layer is +-5
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机译:已通过热线化学气相沉积(HWCVD)以15 A / s的速率在15°C / s的低温(400-550摄氏度)下在玻璃基板上沉积了多晶硅膜(5至30 umm厚)。沉积层为+ -5
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