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A 1.5GHz third generation Itanium 2 processor

机译:1.5GHz第三代Itanium 2处理器

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This 130nm Itanium® 2 processor implements the Explicitly Parallel Instruction Computing (EPIC) architecture and features an on-die 6MB, 24-way set associative L3 cache. The 374mm2 die contains 410M transistors and is implemented in a dual-Vt process with 6 layers copper interconnect and FSG dielectric. The processor runs at 1.5GHz at 1.3V and dissipates a maximum of 130W. This paper reviews circuit design and package details, power delivery, RAS, DFT and DFM features, as well as an overview of the design and verification methodology. The fuse-based clock de-skew circuit achieves 24ps skew across the entire die, while the scan-based skew control further reduces it to 7ps. The 128-bit front-side bus supports up to 4 processors on a single bus with a bandwidth of up to 6.4GB/s.
机译:这款130nm的Itanium®2处理器实现了显式并行指令计算(EPIC)架构,并具有片上6MB,24路集关联L3高速缓存。 374mm 2 芯片包含410M晶体管,采用双Vt工艺实现,具有6层铜互连和FSG电介质。该处理器在1.3V和1.3V下运行于1.5GHz,最大耗散130W。本文回顾了电路设计和封装的详细信息,电源输出,RAS,DFT和DFM功能,以及设计和验证方法的概述。基于保险丝的时钟偏移电路在整个芯片上实现了24ps的偏移,而基于扫描的偏移控制将其进一步降低至7ps。 128位前端总线在一条总线上最多支持4个处理器,带宽高达6.4GB / s。

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