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Hierarchical interconnect modeling

机译:分层互连建模

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摘要

Interconnect parasitics are competing with devices for impact on performance and therefore accurate interconnect modeling is called for. However, fully accurate 3D modeling is not always necessary nor feasible and a hierarchical modeling approach is advocated. Electromagnetic models, transmission lines, and lumped elements can be incorporated as linear circuit elements, reduced, and simulated with device-level models.
机译:互连寄生器件正在与器件竞争以影响性能,因此需要精确的互连建模。但是,完全精确的3D建模并非总是必需且不可行,因此提倡使用分层建模方法。电磁模型,传输线和集总元件可以合并为线性电路元件,可以通过设备级模型进行简化和仿真。

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