Efficient modeling and simulation of interconnects

摘要

An efficient method to compute the 2-D capacitance matrix of coupled microstrip lines is presented. The method is also applicable to conductors of arbitrary polygon shape embedded in a multilayered dielectric medium with possible ground planes on the top or bottom of the dielectric layers. An optimal technique for the transient simulation of distributed multiconductor RLGC lines is then used by applying an indirect numerical integration scheme to the device model for a distributed line. The resulting technique can be directly used in a circuit simulator. The computational complexity is linearly proportional to the number of time steps.