Abstract: The control of metallization layers' integrity gain more importance increasing the total number of metallization layers. Therefore, an electrical measurement procedure has to separate defectless test structure elements from faulty test structure elements. To decrease the number of test procedures and test equipment, this binary decision will be made parallel to the functional test of product chips using the same digital test system to measure test structure elements too. In addition, the geometrical arrangement of the test structure layout elements will also be transformed to binary description. As a result of this, novel algorithms will now enable the direct comparison of both binary data sets to extract test structure faults like opens and shorts as well as process specific defect parameters.!10
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