Glob-top reliability characterisation: evaluation and analysismethods

摘要

Glob-top encapsulation has found widespread acceptance inelectronics assembly for low-end consumer products. To extend the use ofthis encapsulation method to high reliability and harsh environmentconditions, a rigorous evaluation of the available materials is needed.Analysis techniques to determine failure modes and mechanisms are alsonecessary to fully understand and improve glob-top performance. Thispaper outlines the results of glob-top reliability trials and alsoincludes findings on both destructive and nondestructive analysistechniques