A generic tolerance analysis model with illustrations for TAB bonding

摘要

From first principles a generic model which can be applied to a variety of problems associated with placement errors, which are not limited to overlapping features alone is generated. The same model with minor changes is used to predict what the tolerances on a die and bond stage should be, such that the die edge does not interfere with the edges of the cavity of the bond stage when it is placed in the stage. The model is verified with actual data, and proves to be quite accurate.