Low cost, high volume applications to drive high performance Si-on-Si MCM

摘要

Summary form only given. As the design rule gap between VLSI and packaging technology widens, the mismatch of the electrical environments between on-chip and off-chip becomes more and more serious. Multichip module (MCM) technology has the potential to address these issues. The key focus is to bring chips close together, so that the on-chip electrical environment can be preserved in the inter-chip interconnection. The combination of flip-chip attachment and the fine line interconnection is the best way to achieve this. By connecting chips in compact modules, with new chip I/O design to fit the new interconnection environment, this technology can dramatically improve system speeds. It can also provide the high interconnect density to support highly parallel architectures and drastically reduce power requirements and size to support miniaturization for portable electronics.