首页> 外文会议>Electrical Performance of Electronic Packaging, 1993 >Full wave characterization of a through hole via
【24h】

Full wave characterization of a through hole via

机译:通孔过孔的全波表征

获取原文

摘要

The frequency-dependent propagation characteristics of a via penetrating through a hole in the ground plane are investigated by a numerical approach which combines the moment method and the matrix pencil method to extract the scattering parameters. Numerical results are included to discuss the frequency dependence of the propagation characteristics and the effects due to various geometric parameters of the via structure.
机译:通过将矩量法和矩阵笔法相结合以提取散射参数的数值方法,研究了贯穿通孔的频率随频率变化的传播特性。包括数值结果以讨论传播特性的频率依赖性以及通孔结构的各种几何参数所产生的影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号