Proceedings of IEEE Electrical Performance of Electronic Packaging

机译：电子封装的IEEE电气性能论文集

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The following topics are dealt with: system design; microwave packaging; electromagnetic modeling and parameter extraction; automated package design; measurements; modeling; packaging for communications; simulation; and characterization.

机译：处理以下主题：系统设计;微波包装;电磁建模和参数提取;自动化包装设计;测量;造型;通讯包装;模拟;和表征。

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《Electrical Performance of Electronic Packaging, 1993》|1993年||共1页
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中图分类无线电电子学、电信技术;
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Proceedings of IEEE Electrical Performance of Electronic Packaging

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