首页> 外文会议>Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International >Special considerations for the implementation of statistical process control (SPC) for surface mount technology (SMT)
【24h】

Special considerations for the implementation of statistical process control (SPC) for surface mount technology (SMT)

机译:实施表面贴装技术(SMT)的统计过程控制(SPC)的特殊注意事项

获取原文

摘要

There are four major 'new' directions in todays' high tech electronics manufacturing: tom provides a broad base for overall quality includes concepts such as spc; spc to provide improved quality and controls and; includes concepts such as Kaizen and Anova; SMT, surface mount technology, and also computer systems in general. We 'must' integrate these key concepts into our quality and manufacturing paradigms. This applies to both commercial and defense 'products. there is a major industrial revolution now in progress in the electronics industry including microelectronics and PCB's. there have been only a few published papers describing selected SPC applications in SMT operations. This paper presents various SPC understandings and approaches; it includes a section dealing with a continuous process improvement technique for wave solder processing. several key SMT-SPC related articles are referenced and selected data provided.
机译:在当今的高科技电子制造中,有四个主要的“新”方向:汤姆为包括诸如SPC等概念的整体质量提供了广阔的基础; spc提供改进的质量和控制,以及包括Kaizen和Anova等概念; SMT,表面贴装技术以及一般的计算机系统。我们“必须”将这些关键概念整合到我们的质量和制造范式中。这适用于商业和国防产品。电子行业正在发生一场重大的工业革命,包括微电子学和PCB。仅有几篇公开的论文描述了SMT操作中选定的SPC应用程序。本文介绍了SPC的各种理解和方法。它包括有关波峰焊加工的连续工艺改进技术的部分。参考了几篇与SMT-SPC相关的关键文章,并提供了选定的数据。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号