首页> 外文会议>Electronic Components and Technology Conference, 1992. Proceedings., 42nd >Packaging technology for high-power, singlemode-fiber-pigtailed pump laser modules for Er-doped fiber amplifiers
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Packaging technology for high-power, singlemode-fiber-pigtailed pump laser modules for Er-doped fiber amplifiers

机译:掺Er光纤放大器的大功率单模尾纤泵浦激光器模块的封装技术

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A packaging technology for efficiently coupling a conical microlens single-mode fiber to a laser diode has been developed. A two-step approach has been used in which angular and linear alignments are carried out separately by using reusable fixtures. A thermoelectric cooler and a thermocouple are used to maintain the laser at a constant temperature of 15 degrees C. Using this approach, the authors have achieved submicron alignment between the laser and the lensed fiber and have obtained 106-mW fiber-coupled power in a 1480-nm wavelength packaged laser diode module which has been successfully used in pumping Er-doped fiber amplifiers.
机译:已经开发出一种用于将圆锥形微透镜单模光纤有效耦合到激光二极管的封装技术。已经使用了两步方法,其中通过使用可重复使用的夹具分别进行角度和线性对齐。使用热电冷却器和热电偶将激光器保持在15摄氏度的恒定温度下。使用这种方法,作者已经实现了激光器和透镜光纤之间的亚微米对准,并获得了106 mW的光纤耦合功率。 1480 nm波长封装的激光二极管模块已成功用于泵浦掺Er光纤放大器。

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