Tape on substrate, a new systems approach for manufacturing multilayer hybrid circuits

摘要

The authors describe a reliable and potentially cost-effective system of dielectric tape, conventional thick film conductors, and process technology for manufacturing low-layer-count multilayer circuits on alumina substrates. The overall system is designated as tape on substrate (TOS). The materials system and process steps for this system, representing an easy entry-level technology for thick-film hybrid circuit manufacturers, are described in detail. Potential circuit manufacturing concepts for high-volume production are also examined.