An innovation to a multilayer hybrid circuit laminate composed of a sophisticated-resin combination of a new aramid-paper and an epoxy impregnant

摘要

A wholly organic substrate that combines aramid-paper reinforcement and a sophisticated epoxy resin is presented. The reinforcement consists of an organic fiber mat composed of aromatic polyether amide. The impregnant is an aromatic amine-adducted epoxy of low volatility. The properties of the material and their theoretical basis are examined. Experimental results on a 0.4-mm-thick substrate of this material are presented and discussed.