Design for manufacturability in hermetic product die attach

摘要

Die attachment for large die in hermetic product is reviewed as a case study in design for manufacturability. Performance goals are optimum thermal dissipation and mechanical adhesion meeting Military Standard (Mil. Std.) 883, Die Shear Method 2019, as an adhesion baseline. Adhesion measurement technologies are reviewed with emphasis given to practical production application. Die attachment technology is briefly surveyed to identify process characteristics among solder, eutectic, and glass die attachments. Silver glass die attachment is selected for further study. The process design method is summarized as determining the measurement criteria, selecting a technique to meet those criteria, characterizing the technique for production repeatability, and establishing production monitors to confirm that the technique is being followed.